Ideal Vacuum Circular Magnetron Sputtering Targets, TITANIUM OXIDE - TiO2 Sputtering Target, 3'' Diameter x 0.125" Thick, 99.99 Percent Purity - White, Metallic Bonded to a OFHC Copper Backing Plate
Ideal Vacuum Products, LLC.
This product is a circular magnetron TiO2 sputtering target (white), with a 3'' diameter x 0.125" thickness. It is 99.99% pure, and is metallically bonded to a OFHC (Oxygen-Free High Conductivity) copper backing plate
We use a very competitive pricing strategy to ensure you receive the highest quality products at the best possible value, giving you both affordability and excellence in every purchase. We offer huge discounts to every customer, customers who place bulk orders will enjoy huge savings. We stock huge quantities of our products to give our customers guaranteed same day shipping after placing an order. This short lead time is loved by all our customers who look to manage their cash flow with quicker turnaround times. Our regular customers can maintain lower inventory levels, decreasing storage costs and minimizing the risk of obsolescence. Buying from Ideal Vacuum means a customer receives their product more quickly, enhancing satisfaction and meeting their urgent needs. This also enables our customers to stay ahead of their competition by quickly adapting to new trends and demands.
Titanium Dioxide
Titanium dioxide (TiO2) is a white, crystalline chemical compound widely used for its high refractive index and stability. It exists in three main forms: rutile, anatase, and brookite. TiO2 is primarily used as a pigment in paints, coatings, and plastics due to its excellent opacity and brightness.
Titanium dioxide (white) is used in optical coatings primarily for its high refractive index, making it ideal for anti-reflective, interference, and high-reflectivity coatings. It is used in multilayer optical designs such as dielectric mirrors and filters, enhancing reflectance or transmission in specific wavelength ranges. Its stability and transparency in the visible to near-infrared spectrum also make it suitable for lenses, beam splitters, and protective coatings, where precise light control and high optical quality are required.
RF vs DC Sputtering:
RF sputtering is often the preferred method for sputtering pure metallic oxides because they are insulators and RF has an alternating electric field that prevents charge buildup on the target surface. This alternating field reduces the charge accumulation that would otherwise cause arcing in DC sputtering.
Deposition rate:
Lower deposition rate: In RF sputtering, the power transfer to the plasma is less efficient compared to DC, primarily due to the alternating nature of the electric field. This results in a lower deposition rate compared to DC sputtering under equivalent power conditions.
Target Material:
For conductive targets (like titanium in reactive sputtering), DC sputtering has a higher deposition rate. For insulating targets like pure metal oxides, RF sputtering must be used, and deposition rates are typically lower.
Power Levels:
Increasing the power can increase deposition rates in both RF and DC sputtering, but deposition rates still tend to be higher in DC for conductive materials.
Pressure and Gas Flow:
Higher deposition rates can be achieved by optimizing the gas pressure and flow, with different optimal conditions for RF vs. DC.
Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.
