Ideal Vacuum Circular Magnetron Sputtering Targets, MOLYBDENUM - Mo Sputtering Target, 3'' Diameter x 0.25" Thick, 99.95 % Percent Purity

This product is a circular magnetron Molybdenum - Mo sputtering target, with a 3'' diameter x 0.25" thickness. It is 99.95% pure.

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MOLYBDENUM (Mo)

Key Properties

Appearance: Silvery-gray, lustrous transition metal

Density: ~10.22 g/cm³

Crystal Structure: Body-centered cubic (BCC)

Melting Point: 2623 °C (very high thermal stability)

Boiling Point: ~4639 °C

Thermal Conductivity: ~138 W/m·K (high, excellent heat dissipation)

Electrical Resistivity: ~5.34 µO·cm (good conductor, ideal for DC sputtering)

Chemical Stability: Good corrosion resistance; forms a stable oxide (MoO3) in air at elevated temperatures

Sputtering Behavior: High melting point and good thermal conductivity allow high power densities without damage; sputters cleanly with DC or pulsed DC power

Key Applications:

Molybdenum is a widely used target material in PVD sputtering for producing films with excellent conductivity, adhesion, and stability.

Semiconductor Metallization: Gate and interconnect layers in TFTs and other devices

Transparent Conductive Oxide (TCO) Back Contacts: Mo layers under CIGS solar cells for adhesion and conductivity

Barrier Layers: Diffusion barriers in microelectronics (e.g., preventing Cu migration)

Reflective & Optical Coatings: High reflectivity in infrared, used in thermal mirrors and IR optics

Hard & Wear-Resistant Coatings: Protective metallic layers in mechanical components

Adhesion Layers: Promotes adhesion between ceramics, semiconductors, and other metals in multilayer stacks



Summary
Molybdenum’s high melting point, excellent thermal/electrical conductivity, and chemical stability make it a robust and versatile thin film material for electronics, photovoltaics, optics, and protective coatings in PVD applications.

Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.