The Edwards iXM is a new range of dry pumps built for green
manufacturing. Using very low energy the efficient roots mechanism has
been developed to dramatically reduce input power to
1.3 kW, 60% lower than the previous generation of dry
pumps, reducing environmental impact and lowering cost of
ownership.
Gas barrier technology and thermal design improvements
enable four times greater corrosion resistance than iH Series
product. Advanced powder handling features mean iXM
will deliver maximum reliability and extended pump life for
multi-layer etch processes and reduced power consumption
for CVD processes.
The Edwards iXM series pumps are compact and of light-weight design, combined with
exceptionally low noise and vibration, makes iXM the
most versatile dry pump in the Edwards range. iXM will
transform your expectations of dry vacuum pump technology,
deliver real benefits and increased uptime, with minimal
environmental impact. iXM pumps are designed for use in most semiconductor
processes while delivering significant reductions in input power. For complete Instruction Manual see DOWNLOADS.
FEATURES and BENEFITS:
- Primarily for Clean to Light Harsh Chemical Applications (See Application Spectrum Below)
- Peak Pumping Speed 200 m3/h-1 (118 CFM)
- Ultimate Pressure 1.5 X 10-2 Torr
- Contains Primary Pump Only
- No preventative maintenance required
- 3/8 inch Quick Connect Water Fillings
- Water & Power Connection Mating Halves
- SS Water Cooling System
- Varimode Gas Module
APPLICATIONS:
- Load Lock
- Transfer
- Meteorology
- Lithography
- Physical Vapor Deposition PVD Process
- Physical Vapor Deposition PVD Pre-clean
- Rapid Thermal Anneal RTA
- Strip/Ashing
- Etching
- Implant Source
- High-Density Plasma Chemical Vapor Deposition HDP CVD
- Rapid Thermal Processing RTP
- Sub-Atmospheric Chemical Vapor Deposition SACVD
- Tungsten Chemical Vapor Deposition WCVD
- Modified Chemical-Vapor Deposition MCVD
- Plasma-Enhanced Chemical Vapor Deposition PECVD
- Low Pressure Chemical Vapor Deposition LPCVD
