Physical Vapor Deposition Pellets, Copper Pellets - Cu, 99.999% Pure, Atomic Weight 63.546 amu, Melting Point 1,083 °C, 6 x 6 mm Pellets, 100 Gram Bottle
Ideal Vacuum Products, LLC.

If you are looking for high quality PVD evaporation materials for your process, you have come to the right place. This product is a bottle of 100 grams of high purity copper (Cu) pellets (99.999%) that are 6 x 6 mm in size and ships in PET plastic or glass bottles. These pellets have a density of 8.92 g/cc, a melting point of 1083°C, and a vapor pressure of 10-4 Torr at 1,017°C. Its coefficient of thermal expansion is 16.5 x 10-6/K, and in context of thin films deposition, it has a Z ratio of 0.437.

We use a very competitive pricing strategy to ensure you receive the highest quality products at the best possible value, giving you both affordability and excellence in every purchase. We offer discounts to every customer, customers who place bulk orders will enjoy deeper discounts. We carry a large stocking inventory of PVD evaporation materials so that most orders ship out the same day that the order is placed. This short lead time is loved by all our customers who look to manage their cash flow, maintain lower inventory levels, and decrease storage costs. Buying from Ideal Vacuum means a customer receives their product quickly, enhancing satisfaction, while meeting their urgent inventory needs. This also enables our customers to stay ahead of their competition by quickly adapting to new trends and demands.

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Copper
Copper is a chemical element with the symbol Cu and atomic number 29. It is a reddish-gold metal that is highly conductive of electricity and heat. It has a density of 8.92 g/cc, a melting point of 1083°C, and a vapor pressure of 10-4 Torr at 1,017°C. Its coefficient of thermal expansion is 16.5 x 10-6/K, and in context of thin films deposition, it has a Z ratio of 0.437.

Copper is widely used in the thin film industry due to its excellent electrical conductivity, thermal properties, and adhesion characteristics. It can be melted and evaporated using E-beam evaporation or resistive heating in crucibles, evaporation boats and wire baskets. Below are a few examples where copper thin films are utilized.

Thin Films Applications of Copper

Interconnects in Microelectronics: Copper thin films are used in integrated circuits and semiconductor devices to create efficient electrical pathways between components due to their low electrical resistance.
Coatings and Plating: Copper thin films serve as conductive layers in various electronic devices, providing a reliable and efficient conductive surface for further deposition or electroplating.
Reflective Coatings: Copper's high reflectivity makes it suitable for use in optical coatings and mirrors, enhancing the efficiency of devices that rely on light reflection.
Barrier Layers: In multi-layer thin film structures, copper can act as a diffusion barrier to prevent the intermixing of different materials, maintaining the integrity and performance of the layers.
Sensors and Catalysts: Copper thin films are employed in gas sensors and as catalysts in chemical reactions due to their reactive surface properties.
Target Backing Plates: Sputtering targets in vacuum coating machines are traditionally bonded to copper backing plates.

Overall, copper's versatility and favorable physical and chemical properties make it a valuable material in the production of thin films for various advanced technological applications.

Ideal Vacuum Products supplies a wide size range of evaporation pellets at a very competitive price and short lead time. Please review other pellet size options below and reach out to our sales team for any inquiries. We also take custom pellet size orders to meet your specific requirements.